Antenna having single non-conductive portion and electronic device including the same

ABSTRACT

An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application a continuation application of prior application Ser.No. 17/394,909, filed on Aug. 5, 2021, which is a divisional applicationof prior application Ser. No. 16/596,108, filed on Oct. 8, 2019, whichhas issued as U.S. Pat. No. 11,114,744 on Sep. 7, 2021 and is based onand claims priority under 35 U.S.C. § 119(a) of a Korean patentapplication number 10-2018-0122922, filed on Oct. 16, 2018, in theKorean Intellectual Property Office, the disclosure of which isincorporated by reference herein in its entirety.

BACKGROUND 1. Field

The disclosure relates to an antenna using a single non-conductiveportion and an electronic device including the antenna.

2. Description of the Related Art

Advances in electronics and communication technologies have enableddevelopment of electronic devices having various functions and shapes.Such electronic devices are convergence devices that can perform one ormore functions in combination.

As the functional gap between manufacturers has narrowed significantlyin recent years, to satisfy consumer needs, electronic devices arebecoming slimmer, while conductive members (e.g., metal frames or metalbezels) are used to increase their rigidity. In the case of anelectronic device for communication, at least a portion of theconductive member may be used as the antenna for slimming, whichrequires improvement in radiation performance.

When the exterior of an electronic device is made of a conductive member(e.g., metal frame or metal bezel) to meet the slimming trend ofelectronic devices, unlike an injection molded dielectric material, theantenna is not separately designed but at least a portion of theconductive member may be used as the antenna. For example, when aconductive member serving as the side member of the electronic device isused as an antenna, the segment between conductive members may be filledwith a non-conductive dielectric material and may be used as aninsulation part for electrically disconnecting a specific location ofthe conductive member. Hence, the electrical length of the antenna fromthe feeder can be adjusted, enabling the antenna to operate in aspecified frequency band.

The antenna may be utilized as a radiator by feeding a unit conductiveportion of the conductive member electrically insulated by a pair ofnon-conductive portions spaced at a given interval. For example, it ispreferable to design the antenna so as to cover various low bandsrequired by the operator. However, the unit conductive portion segmentedby the pair of non-conductive portions has a limited physical length dueto the slimming of the electronic device, and cannot cover various lowbands even when a matching circuit or an additional radiator is used. Inaddition, even when the frequency is shifted in the low band by using amatching circuit or an additional radiator, the performance may bedegraded as the frequency shifts to a lower frequency owing to thelimitation of the physical length of the conductive portion.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providean antenna using a single non-conductive portion and an electronicdevice including the same.

Another aspect of the disclosure is to provide an antenna using a singlenon-conductive portion and an electronic device including the same thatcan produce a specified radiation performance when shifted in a lowband.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, an electronic device isprovided. The electronic device includes a foldable housing including, ahinge structure, a first housing structure connected to the hingestructure and including a first surface facing in a first direction, asecond surface facing in a second direction opposite to the firstdirection, and a first side member, wherein the first side memberencloses at least a portion of a space between the first surface and thesecond surface and includes a first conductive portion, a firstnon-conductive portion, and a second conductive portion arranged insequence from the hinge structure, and a second housing structureconnected to the hinge structure and foldable with the first housingstructure with respect to the hinge structure, and including a thirdsurface facing in a third direction, a fourth surface facing in a fourthdirection opposite to the third direction, and a second side member,wherein the second side member encloses at least a portion of a spacebetween the third surface and the fourth surface and includes a thirdconductive portion, a second non-conductive portion, a fourth conductiveportion, a third non-conductive portion, and a fifth conductive portionarranged in sequence from the hinge structure, wherein the first surfacefaces the third surface in a folded state and the third direction is thesame as the first direction in an unfolded state, a flexible displayextending from the first surface to the third surface, a printed circuitboard disposed between the first surface and the second surface andincluding at least one ground layer, at least one wireless communicationcircuit disposed in the printed circuit board and including a firstelectrical path carrying a first signal of a first frequency band and asecond electrical path carrying a second signal of a second frequencyband, a first variable element including a first terminal electricallyconnected to the first electrical path, a second terminal electricallyconnected to the ground layer, and a third terminal electricallyconnected to a first position of the second conductive portion, and asecond variable element including a fourth terminal electricallyconnected to the second electrical path, a fifth terminal electricallyconnected to the ground layer, and a sixth terminal electricallyconnected to a third electrical path connected to a second position ofthe second conductive portion, the second position being closer to thefirst non-conductive portion than the first position.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a housing including afirst plate, a second plate facing away from the first plate, and a sidemember enclosing a space between the first plate and the second plateand connected to the second plate or formed as a single body with thesecond plate, wherein the side member includes a first conductiveportion, a second conductive portion, and a non-conductive portionformed between the first conductive portion and the second conductiveportion, wherein the first conductive portion includes a first positionand a second position closer to the non-conductive portion than thefirst position, a printed circuit board disposed between the first plateand the second plate and including at least one ground layer, at leastone wireless communication circuit disposed in the printed circuit boardand including a first electrical path carrying a first signal of a firstfrequency band and a second electrical path carrying a second signal ofa second frequency band, a first variable element including a firstterminal electrically connected to the first electrical path, a secondterminal electrically connected to the ground layer, and a thirdterminal electrically connected to the first position, and a secondvariable element including a fourth terminal electrically connected tothe second electrical path, a fifth terminal electrically connected tothe ground layer, and a sixth terminal electrically connected to a thirdelectrical path connected to the second position.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a housing including afirst plate, a second plate facing away from the first plate, and a sidemember enclosing a space between the first plate and the second plate,wherein the side member includes a first conductive portion, a secondconductive portion, and a non-conductive portion formed between thefirst conductive portion and the second conductive portion, wherein thefirst conductive portion includes a first position and a second positioncloser to the non-conductive portion than the first position, a printedcircuit board disposed between the first plate and the second plate andincluding at least one ground layer, at least one wireless communicationcircuit disposed in the printed circuit board and including a firstelectrical path electrically connected to the first conductive portionat the first position and carrying a first signal of a first frequencyband, and a second electrical path electrically connected to the firstconductive portion at the second position and carrying a second signalof a second frequency band, a first variable element included in themiddle of the first electrical path, a second variable element includedin the middle of the second electrical path, and at least one processorconfigured to generate a control signal corresponding to the currentmode of the electronic device and apply the control signal to at leastone of the first variable element or the second variable element.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram of an electronic device in a networkenvironment according to an embodiment of the disclosure;

FIG. 2A is a view of the electronic device in the unfolded stateaccording to an embodiment of the disclosure;

FIG. 2B is a view of the electronic device in the folded state accordingto an embodiment of the disclosure;

FIG. 3 is an exploded perspective view of the electronic deviceaccording to an embodiment of the disclosure;

FIGS. 4A and 4B are a view of the electronic device illustrating thearrangement of conductive portions segmented by a single non-conductiveportion according to various embodiments of the disclosure;

FIG. 5 is a view of the electronic device illustrating the arrangementof the antenna according to an embodiment of the disclosure;

FIGS. 6A and 6B illustrate the configuration of the variable elements T1and T2 shown in FIG. 5 according to various embodiments of thedisclosure;

FIGS. 7A and 7B illustrate the electrical connection between a secondconnection piece and a printed circuit board according to variousembodiments of the disclosure;

FIG. 8A is a return loss (S11) chart illustrating changes in theoperating band of the antenna due to adjustment of a first feeder and asecond feeder according to an embodiment of the disclosure;

FIG. 8B is a chart illustrating performance of the antenna for eachoperating band due to adjustment of the first feeder and the secondfeeder according to an embodiment of the disclosure;

FIGS. 9A and 9B are perspective views of the electronic device viewedfrom different angles according to various embodiments of thedisclosure;

FIG. 10 illustrates the arrangement of the antenna in the electronicdevice shown in FIG. 9A according to an embodiment of the disclosure;and

FIG. 11 illustrates a case where the antenna is applied to a wearableelectronic device according to an embodiment of the disclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding, but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purposes only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 1 is a block diagram of an electronic device in a networkenvironment according to an embodiment of the disclosure.

Referring to FIG. 1 , in the network environment 100, the electronicdevice 101 may communicate with an electronic device 102 through a firstnetwork 198 (e.g., short-range wireless communication network) or maycommunicate with an electronic device 104 or a server 108 through asecond network 199 (e.g., long-distance wireless communication network).In one embodiment, the electronic device 101 may communicate with theelectronic device 104 through the server 108. According to anembodiment, the electronic device 101 may include a processor 120, amemory 130, an input unit 150, a sound output unit 155, a display unit160, an audio module 170, a sensor module 176, an interface 177, ahaptic module 179, a camera module 180, a power management module 188, abattery 189, a communication module 190, a subscriber identificationmodule 196, and an antenna module 197. In one embodiment, at least onecomponent (e.g., display unit 160 or camera module 180) among thecomponents of the electronic device 101 may be omitted, or othercomponents may be added to the electronic device 101. In one embodiment,some of these components may be implemented as an integrated circuit.For example, the sensor module 176 (e.g., fingerprint sensor, irissensor, or illuminance sensor) may be embedded in the display unit 160(e.g., display).

The processor 120 may execute, for example, software (e.g., program 140)to control at least one of other components (e.g., hardware component orsoftware component) of the electronic device 101 connected to theprocessor 120, and may process a variety of data or perform variouscomputations. In one embodiment, as part of data processing orcomputation, the processor 120 may load a command or data received fromother components (e.g., sensor module 176 or communication module 190)into the volatile memory 132, process the command or data stored in thevolatile memory 132, and store the result data in the nonvolatile memory134. In one embodiment, the processor 120 may include a main processor121 (e.g., central processing unit, or application processor), and asecondary processor 123 (e.g., graphics processing unit, image signalprocessor, sensor hub processor, or communication processor), which mayoperate independently of or in cooperation with the main processor 121.Additionally or alternatively, the secondary processor 123 may consumeless power or may be more specialized in a specific function comparedwith the main processor 121. The secondary processor 123 may beimplemented separately from or as part of the main processor 121.

The secondary processor 123 may control at least some of the functionsor states associated with at least one component (e.g., display unit160, sensor module 176, or communication module 190) among thecomponents of the electronic device 101, for example, instead of themain processor 121 while the main processor 121 is in an inactive (e.g.,sleep) state, or together with the main processor 121 while the mainprocessor 121 is in an active (e.g., application execution) state. Inone embodiment, the secondary processor 123 (e.g., image signalprocessor or communication processor) may be implemented as a part ofanother component (e.g., camera module 180 or communication module 190)that is functionally related to the secondary processor 123.

The memory 130 may store a variety of data used by at least onecomponent (e.g., processor 120 or sensor module 176) of the electronicdevice 101. The data may include, for example, software (e.g., program140) and input data or output data for commands associated with thesoftware. The memory 130 may include a volatile memory 132 or anonvolatile memory 134.

The programs 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system 142, a middleware 144, or anapplication 146.

The input unit 150 may receive a command or data, which can be to beused for a component (e.g., processor 120) of the electronic device 101,from the outside of the electronic device 101 (e.g., user). The inputunit 150 may include, for example, a microphone, a mouse, a keyboard, ora digital pen (e.g., stylus pen).

The sound output unit 155 may output a sound signal to the outside ofthe electronic device 101. The sound output unit 155 may include, forexample, a speaker and a receiver. The speaker may be used for generalpurposes, such as playback of multimedia or recordings, and the receivermay be used for receiving an incoming call. In one embodiment, thereceiver may be implemented separately from or as part of the speaker.

The display unit 160 may visually present information to the outside ofthe electronic device 101 (e.g., user). The display unit 160 mayinclude, for example, a display, a hologram device, or a projector, anda control circuit for controlling these. In one embodiment, the displayunit 160 may include a touch circuitry configured to sense a touch, or asensing circuitry (e.g., pressure sensor) configured to measure thestrength of a force caused by a touch action.

The audio module 170 may convert a sound into an electric signal orconvert an electric signal into a sound. In one embodiment, the audiomodule 170 may obtain a sound signal through the input unit 150 or mayoutput a sound signal through an external electronic device (e.g.,electronic device 102 (e.g., speaker or headphone)) wiredly orwirelessly connected to the sound output unit 155 or the electronicdevice 101.

The sensor module 176 may generate an electrical signal or a data valuecorresponding to the operating state (e.g., power or temperature) of theelectronic device 101 or the environmental state (e.g., user state)outside the electronic device 101. The sensor module 176 may include,for example, a gesture sensor, a gyro sensor, a barometric pressuresensor, a magnetic sensor, an acceleration sensor, a grip sensor, aproximity sensor, a color sensor, an infrared sensor, a biometricsensor, a temperature sensor, a humidity sensor, or an illuminancesensor.

The interface 177 may support one or more designated protocols thatenable the electronic device 101 to directly or wirelessly connect to anexternal electronic device (e.g., electronic device 102). In oneembodiment, the interface 177 may include, for example, ahigh-definition multimedia interface (HDMI), a universal serial bus(USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which theelectronic device 101 can be physically connected to an externalelectronic device (e.g., electronic device 102). In one embodiment, theconnection terminal 178 may include, for example, an HDMI connector, aUSB connector, a secure digital (SD) card connector, or an audioconnector (e.g., headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., vibration or motion) or an electrical stimulus that canbe perceived by the user through tactile or kinesthetic senses. In oneembodiment, the haptic module 179 may include, for example, a motor, apiezoelectric element, or an electric stimulator.

The camera module 180 may capture a still image or a moving image. Inone embodiment, the camera module 180 may include at least one lens, animage sensor, an image signal processor, or a flash.

The power management module 188 may manage the power supplied to theelectronic device 101. The power management module 188 may beimplemented as part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. In one embodiment, the battery 189 may include,for example, a non-rechargeable primary cell, a rechargeable secondarycell, or a fuel cell.

The communication module 190 may establish a wired or wirelesscommunication channel between the electronic device 101 and the externalelectronic device (e.g., electronic device 102, electronic device 104,or server 108) and support communication through the establishedcommunication channel. The communication module 190 may include at leastone communication processor that can operate separately from theprocessor 120 (e.g., application processor) to support wired or wirelesscommunication. In one embodiment, the communication module 190 mayinclude a wireless communication module 192 (e.g., cellularcommunication module, short-range wireless communication module, orglobal navigation satellite system (GNSS) communication module), or awired communication module 194 (e.g., local area network (LAN)communication module, or power line communication module). Thecorresponding communication module may communicate with an externalelectronic device through the first network 198 (e.g., short-rangecommunication network such as Bluetooth, Wi-Fi direct, or infrared dataassociation (IrDA)) or through the second network 199 (e.g.,long-distance communication network such as a cellular network, theInternet, or a computer network such as a LAN or WAN). The above variouscommunication modules may be implemented as one component (e.g., singlechip) or as separate components (e.g., multiple chips). The wirelesscommunication module 192 may identify and authenticate the electronicdevice 101 in the communication network such as the first network 198 orthe second network 199 by using subscriber information stored in thesubscriber identification module 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., external electronic device). In one embodiment,the antenna module 197 may include one antenna having a radiator made ofa conductor or conductive pattern formed on a substrate (e.g., PCB). Inone embodiment, the antenna module 197 may include a plurality ofantennas. In this case, at least one antenna suitable for thecommunication scheme used in the communication network such as the firstnetwork 198 or the second network 199 may be selected from the pluralityof antennas by, for example, the communication module 190. The signal orpower may be transmitted or received between the communication module190 and the external electronic device through the selected at least oneantenna. In one embodiment, in addition to the radiator, anothercomponent (e.g., RFIC) may be further formed as part of the antennamodule 197.

At least some of the above components may be connected to each other viaa communication scheme between peripherals (e.g., bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIMI)), and may exchange signals (e.g.,commands or data) with each other.

In one embodiment, commands or data may be exchanged between theelectronic device 101 and the external electronic device 104 through theserver 108 connected to the second network 199. The electronic devices102 and 104 may be of the same type as or a different type from theelectronic device 101. In one embodiment, all or some of the operationsthat can be performed by the electronic device 101 may be performed byone or more of the external electronic devices 102, 104 and 108. Forexample, to perform a certain function or service automatically or uponrequest, the electronic device 101 may, instead of or in addition toexecuting the function or service, request one or more externalelectronic devices to execute at least some of the function or service.Upon reception of the request, the external electronic devices mayexecute at least a portion of the requested function or service or anadditional function or service related to the request, and return theexecution results to the electronic device 101. The electronic device101 may further process the received results if necessary and providethe processing results as a response to the requested function orservice. To this end, technologies such as cloud computing, distributedcomputing, and client-server computing may be used.

The electronic device according to various embodiments disclosed hereincan be one of various types of devices, such as portable communicationdevices (e.g., smartphones), computers, portable multimedia devices,portable medical instruments, cameras, wearable devices, and homeappliances. However, the electronic device is not limited to theabove-mentioned devices.

It should be understood that the various embodiments of the disclosureand the terminology used herein are not intended to limit the techniquesdescribed herein to specific embodiments but to include variousmodifications, equivalents, and/or alternatives thereof. In thedrawings, the same or similar reference symbols are used to refer to thesame or like parts. In the description, the singular forms “a”, “an” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. In the description, the expression“A or B”, “at least one of A and/or B”, “A, B or C”, or “at least one ofA, B and/or C” may indicate all possible combinations of the listeditems. The terms “first” and “second” may refer to various elementsregardless of importance and/or order and are used to distinguish oneelement from another element without limitation. It will be understoodthat when an element (e.g., first element) is referred to as being(functionally or communicatively) “coupled with/to” or “connectedwith/to” another element (e.g., second element), it can be coupled orconnected with/to the other element directly (wiredly), wirelessly, orvia a third element.

In the description, the term “module” may refer to a certain unit thatis implemented in hardware, software, firmware, or a combinationthereof. The term “module” may be used interchangeably with the term“unit”, “logic”, “logical block”, “component”, or “circuit”, forexample. The module may be the minimum unit, or a part thereof, whichperforms one or more particular functions. For example, a module may beimplemented in the form of an application-specific integrated circuit(ASIC).

Various embodiments of the disclosure may be implemented in software(e.g., programs 140) including instructions stored in a machine-readablestorage medium (e.g., internal memory 136 or external memory 138)readable by a machine (e.g., electronic device 101). For example, theprocessor (e.g., processor 120) of the machine (e.g., electronic device101) can fetch a stored instruction from a storage medium and executethe fetched instruction. When the instruction is executed by theprocessor, the machine may perform the function corresponding to theinstruction. The instructions may include a code generated by a compilerand a code executable by an interpreter. The machine-readable storagemedium may be provided in the form of a non-transitory storage medium.Here, “non-transitory” means that the storage medium does not include asignal and is tangible, but does not distinguish whether data is storedsemi-permanently or temporarily in the storage medium.

The method according to various embodiments disclosed herein may beprovided as a computer program product. A computer program product maybe traded between a seller and a purchaser as a commodity. A computerprogram product may be distributed in the form of a machine-readablestorage medium (e.g., compact disc read only memory (CD-ROM)) or bedistributed online (e.g., download or upload) directly between two userdevices (e.g. smartphones) through an application store (e.g.,PlayStore™). For on-line distribution, at least a portion of thecomputer program product may be temporarily stored or temporarilycreated in a storage medium such as a memory of a manufacturer's server,an application store's server, or a relay server.

Each of the components (e.g., modules or programs) according to variousembodiments described above may be composed of one or more elements. Anexisting component may be omitted, and a new component may be added.Alternatively or additionally, some of the components (e.g., modules orprograms) may be combined into one entity while maintaining the samefunctionality. Operations supported by a module, program, or anothercomponent may be carried out in sequence, in parallel, by repetition, orheuristically. Some operations may be executed in a different order ormay be omitted, and a new operation may be added.

FIG. 2A is a view of an electronic device in the unfolded stateaccording to an embodiment of the disclosure.

FIG. 2B is a view of an electronic device in the folded state accordingto embodiment of the disclosure.

Embodiments for the electronic device 200 of FIGS. 2A and 2B may be atleast partially similar to or different from those for the electronicdevice 101 of FIG. 1 .

Referring to FIG. 2A, the electronic device 200 may include a pair ofhousing structures 210 and 220 rotatably coupled via a hinge structure(e.g., hinge structure 264 in FIG. 3 ) to be folded relative to eachother, a hinge cover 265 covering the foldable portion of the pair ofhousing structures 210 and 220, and a display 230 (e.g., flexibledisplay or foldable display) disposed in the space formed by the pair ofhousing structures 210 and 220. The surface on which the display 230 isdisposed may be referred to as the front surface of the electronicdevice 200, and the opposite side of the front surface may be referredto as the rear surface of the electronic device 200. The surfacesurrounding the space between the front surface and the rear surface maybe referred to as the side surface of the electronic device 200.

In one embodiment, the pair of housing structures 210 and 220 mayinclude a first housing structure 210 including a sensor region 231 d, asecond housing structure 220, a first rear cover 240, and a second rearcover 250. The pair of housing structures 210 and 220 of the electronicdevice 200 are not limited to the shape or combination shown in FIGS. 2Aand 2B, but may be implemented in various shapes or combinations. Forexample, in another embodiment, the first housing structure 210 and thefirst rear cover 240 may be formed as a single body, and the secondhousing structure 220 and the second rear cover 250 may be formed as asingle body.

In one embodiment, the first housing structure 210 and the secondhousing structure 220 may be disposed at both sides with respect to thefolding axis (A axis) and may be substantially symmetrical with respectto the folding axis (A axis). In one embodiment, the angle or distancebetween the first housing structure 210 and the second housing structure220 may vary depending upon whether the electronic device 200 is in theflat state or closed state, the folded state, or the intermediate state.In one embodiment, the first housing structure 210 includes the sensorregion 231 d where various sensors are disposed, but may have asymmetrical shape with the second housing structure 220 in otherregions. In another embodiment, the sensor region 231 d may be disposedin a specific region of the second housing structure 220 or may bereplaced.

In one embodiment, during the flat state of the electronic device 200,the first housing structure 210 may be connected to the hinge structure(e.g., hinge structure 264 in FIG. 3 ), and may include a first surface211 facing the front surface of the electronic device 200, a secondsurface 212 facing away from the first surface 211, and a first sidemember 213 enclosing at least a portion of the space between the firstsurface 211 and the second surface 212. In one embodiment, the firstside member 213 may include a first side surface 213 a disposed inparallel with the folding axis (A axis), a second side surface 213 bextending from one end of the first side surface 213 a in a directionperpendicular to the folding axis, and a third side surface 213 cextending from the other end of the first side surface 213 a in adirection perpendicular to the folding axis.

In one embodiment, during the flat state of the electronic device 200,the second housing structure 220 may be connected to the hinge structure(e.g., hinge structure 264 in FIG. 3 ), and may include a third surface221 facing the front surface of the electronic device 200, a fourthsurface 222 facing away from the third surface 221, and a second sidemember 223 enclosing at least a portion of the space between the thirdsurface 221 and the fourth surface 222. In one embodiment, the secondside member 223 may include a fourth side surface 223 a disposed inparallel with the folding axis (A axis), a fifth side surface 223 bextending from one end of the fourth side surface 223 a in a directionperpendicular to the folding axis, and a sixth side surface 223 cextending from the other end of the fourth side surface 223 a in adirection perpendicular to the folding axis. In one embodiment, thethird surface 221 may face the first surface 211 in the folded state.

In one embodiment, the electronic device 200 may include a recess 201formed to accommodate the display 230 through a structural combinationof the shapes of the first housing structure 210 and the second housingstructure 220. The recess 201 may have substantially the same size asthe display 230. In one embodiment, the recess 201 may have two or moredifferent widths in a direction perpendicular to the folding axis (Aaxis) due to the sensor region 231 d. For example, the recess 201 mayhave a first width (W1) between a first portion 220 a of the secondhousing structure 220 parallel to the folding axis (A axis) and a firstportion 210 a of the first housing structure 210 formed at the edge ofthe sensor region 231 d, and have a second width (W2) between a secondportion 220 b of the second housing structure 220 and a second portion210 b of the first housing structure 210 that does not correspond to thesensor region 213 d and is parallel to the folding axis (A axis).

The second width (W2) may be wider than the first width (W1). The recess201 may be formed to have the first width (W1) ranging from the firstportion 210 a of the first housing structure 210 to the first portion220 a of the second housing structure 220 (asymmetric shape), and thesecond width (W2) ranging from the second portion 210 b of the firsthousing structure 210 to the second portion 220 b of the second housingstructure 220 (symmetric shape). In one embodiment, the first portion210 a and the second portion 210 b of the first housing structure 210may be located at different distances from the folding axis (A axis).The width of the recess 201 is not limited to the example shown above.In various embodiments, the recess 201 may have two or more differentwidths owing to the shape of the sensor region 213 d or the asymmetry ofthe first housing structure 210 or the second housing structure 220.

In one embodiment, at least a portion of the first housing structure 210and the second housing structure 220 may be made of a metal or non-metalmaterial having a rigidity value selected to support the display 230.

In one embodiment, the sensor region 231 d may be formed to have apreset area near to one corner of the first housing structure 210.However, the arrangement, shape, or size of the sensor region 231 d isnot limited to the illustrated example. For example, in a certainembodiment, the sensor region 231 d may be formed at another corner ofthe first housing structure 210 or in any region between the uppercorner and the lower corner. In another embodiment, the sensor region231 d may be disposed at a portion of the second housing structure 220.In another embodiment, the sensor region 231 d may be formed to extendbetween the first housing structure 210 and the second housing structure220. In one embodiment, to perform various functions, the electronicdevice 200 may include components exposed to the front surface of theelectronic device 200 through the sensor region 213 d or through one ormore openings provided in the sensor region 231 d. The components mayinclude, for example, at least one of a front camera, a receiver, aproximity sensor, an illuminance sensor, an iris recognition sensor, anultrasonic sensor, or an indicator.

In one embodiment, the first rear cover 240 may be disposed on thesecond surface 212 of the first housing structure 210 and may have asubstantially rectangular periphery. In one embodiment, at least aportion of the periphery may be wrapped by the first housing structure210. Similarly, the second rear cover 250 may be disposed on the fourthsurface 222 of the second housing structure 220, and at least a portionof the periphery thereof may be wrapped by the second housing structure220.

In the illustrated embodiment, the first rear cover 240 and the secondrear cover 250 may have a substantially symmetrical shape with respectto the folding axis (A axis). In another embodiment, the first rearcover 240 and the second rear cover 250 may have various differentshapes. In another embodiment, the first rear cover 240 may be formed asa single body with the first housing structure 210, and the second rearcover 250 may be formed as a single body with the second housingstructure 220.

In one embodiment, the first rear cover 240, the second rear cover 250,the first housing structure 210, and the second housing structure 220may be combined with each other so as to provide a space where variouscomponents (e.g., printed circuit board, antenna module, sensor module,and battery) of the electronic device 200 can be arranged. In oneembodiment, one or more components may be disposed on or visuallyexposed via the rear surface of the electronic device 200. For example,one or more components or sensors may be visually exposed through thefirst rear region 241 of the first rear cover 240. The sensors mayinclude a proximity sensor, a rear camera, and/or a flash. In anotherembodiment, at least a portion of the sub-display 252 may be visuallyexposed through the second rear region 251 of the second rear cover 250.

The display 200 may be disposed on the space formed by the pair ofhousing structures 210 and 220. For example, the display 200 may beseated in the recess (e.g., recess 201 in FIG. 2A) formed by the pair ofhousing structures 210 and 220, and may be disposed to substantiallyoccupy most of the front surface of the electronic device 200. The frontsurface of the electronic device 200 may include the display 230, aportion (e.g., edge region) of the first housing structure 210 close tothe display 230, and a portion (e.g. edge region) of the second housingstructure 220 close to the display 230. In one embodiment, the rearsurface of the electronic device 200 may include the first rear cover240, a portion (e.g., edge region) of the first housing structure 210close to the first rear cover 240, the second rear cover 250, and aportion (e.g. edge region) of the second housing structure 220 close tothe second rear cover 250.

In one embodiment, the display 230 may refer to a display who's at leasta portion may be deformed into a flat or curved surface. In oneembodiment, the display 230 may include a folding region 231 c, a firstregion 231 a disposed on one side (e.g., right side of the foldingregion 231 c) with respect to the folding region 231 c, and a secondregion 231 b disposed on the other side (e.g., left side of the foldingregion 231 c). For example, the first region 231 a may be disposed onthe first surface 211 of the first housing structure 210, and the secondregion 231 b may be disposed on the third surface 221 of the secondhousing structure 220. This demarcation of the display 230 is only anexample, and the display 230 may be subdivided into plural regions(e.g., four or more regions) according to the structure orfunctionality. For example, in the embodiment of FIG. 2A, the area ofthe display 230 may be subdivided with respect to the folding area 231 cor the folding axis (A axis) extending parallel to the y-axis. However,in another embodiment, the area of the display 230 may be subdividedwith respect to a different folding region (e.g., folding regionparallel to the x-axis) or a different folding axis (e.g., folding axisparallel to the x-axis). The aforementioned subdivision of the displayis only a physical demarcation based on the pair of housing structures210 and 220 and the hinge structure (e.g., hinge structure 264 in FIG. 3), and the display 230 may substantially present one full screen throughthe pair of housing structures 210 and 220 and the hinge structure(e.g., hinge structure 264 in FIG. 3 ). In one embodiment, the firstregion 231 a and the second region 231 b may have a symmetrical shapewith respect to the folding region 231 c. Although the first region 231a may include a notch region (e.g., notch region 233 in FIG. 3 ) cutaccording to the presence of the sensor region 231 d, it may have asymmetrical shape with the second region 231 b in other portions. Inother words, the first region 231 a and the second region 231 b mayinclude portions with symmetrical shapes and portions with asymmetricalshapes.

Referring to FIG. 2B, the hinge cover 265 may be disposed between thefirst housing structure 210 and the second housing structure 220 so asto cover the internal components (e.g., hinge structure 264 in FIG. 3 ).In one embodiment, the hinge cover 265 may be covered by portions of thefirst housing structure 210 and the second housing structure 220 or beexposed to the outside according to the operating state (e.g., flatstate or folded state) of the electronic device 200.

For example, when the electronic device 200 is in the flat state asshown in FIG. 2A, the hinge cover 265 may be covered by the firsthousing structure 210 and the second housing structure 220 so as not tobe exposed. When the electronic device 200 is in the folded state (e.g.,completely folded state) as shown in FIG. 2B, the hinge cover 265 may beexposed to the outside between the first housing structure 210 and thesecond housing structure 220. When the electronic device 200 is in theintermediate state where the first housing structure 210 and the secondhousing structure 220 make a certain angle, the hinge cover 265 may bepartially exposed to the outside between the first housing structure 210and the second housing structure 220. In this case, the exposed portionmay be less than that for the fully folded state. In one embodiment, thehinge cover 265 may include a curved surface.

Next, a description is given of configurations of the first housingstructure 210 and the second housing structure 220 and regions of thedisplay 230 according to the operating state (e.g. flat state or foldedstate) of the electronic device 200.

In one embodiment, when the electronic device 200 is in the flat state(e.g., state of FIG. 2A), the first housing structure 210 and the secondhousing structure 220 may make an angle of 180 degrees, and the firstregion 231 a and the second region 231 b of the display may be disposedto face in the same direction. In addition, the folding region 231 c maybe coplanar with the first region 231 a and the second region 231 b.

In one embodiment, when the electronic device 200 is in the folded state(e.g., state of FIG. 2B), the first housing structure 210 and the secondhousing structure 220 may be disposed to face each other. The firstregion 231 a and the second region 231 b of the display 230 may faceeach other, making a narrow angle (e.g., between 0 degrees and 10degrees). At least a portion of the folding area 231 c may form a curvedsurface with a preset curvature.

In one embodiment, when the electronic device 200 is in the intermediatestate, the first housing structure 210 and the second housing structure220 may be disposed to make a certain angle. The first region 231 a andthe second region 231 b of the display 230 may form an angle greaterthan that for the folded state and less than that for the flat state. Atleast a portion of the folding area 231 c may form a curved surface witha preset curvature. This curvature may be less than that for the foldedstate.

FIG. 3 is an exploded perspective view of an electronic device accordingto an embodiment of the disclosure.

Referring to FIG. 3 , in one embodiment, the electronic device 200 mayinclude a display 230, a support member assembly 260, at least oneprinted circuit board 270, a first housing structure 210, a secondhousing structure 220, a first rear cover 240, and a second rear cover250. In the description, the display 230 may be referred to as a displayunit, display module, or display assembly.

The display 230 may include a display panel 231 (e.g., flexible displaypanel), and at least one plate 232 or layer on which the display panel231 is seated. In one embodiment, the plate 232 may be disposed betweenthe display panel 231 and the support member assembly 260. The displaypanel 231 may be disposed on at least a portion of one surface (e.g.,surface in the Z direction in FIG. 3 ) of the plate 232. The plate 232may be formed in a shape corresponding to the display panel 231. Forexample, a portion of the plate 232 may be formed in a shapecorresponding to the notch region 233 of the display panel 231.

The support member assembly 260 may include a first support member 261,a second support member 262, a hinge structure 264 disposed between thefirst support member 261 and the second support member 262, a hingecover 265 to cover the hinge structure 264 when viewed from the outside,and a wiring member 263 (e.g., flexible printed circuit board (FPCB))that crosses the first support member 261 and the second support member262.

In one embodiment, the support member assembly 260 may be disposedbetween the plate 232 and at least one printed circuit board 270. Forexample, the first support member 261 may be disposed between the firstregion 231 a of the display 230 and the first printed circuit board 271.The second support member 262 may be disposed between the second region231 b of the display 230 and the second printed circuit board 272.

In one embodiment, at least a portion of the wiring member 263 and thehinge structure 264 may be disposed within the support member assembly260. The wiring member 263 may be disposed in a direction crossing thefirst support member 261 and the second support member 262 (e.g., x-axisdirection). The wiring member 263 may be disposed in a direction (e.g.,x-axis direction) perpendicular to the folding axis (e.g., y-axis orfolding axis (A) in FIG. 2A) of the folding region 231 c.

The at least one printed circuit board 270 may include, as describedabove, the first printed circuit board 271 disposed on the side of thefirst support member 261, and the second printed circuit board 272disposed on the side of the second support member 262. The first printedcircuit board 271 and the second printed circuit board 272 may bedisposed inside the space formed by the support member assembly 260, thefirst housing structure 210, the second housing structure 220, the firstrear cover 240, and the second rear cover 250. Various components forimplementing functions of the electronic device 200 may be mounted onthe first printed circuit board 271 and the second printed circuit board272.

In one embodiment, in a state where the display 230 is coupled to thesupport member assembly 260, the first housing structure 210 and thesecond housing structure 220 may be assembled to each other so as to becoupled to both sides of the support member assembly 260. As describedbelow, the first housing structure 210 and the second housing structure220 may be coupled to the support member assembly 260 by being slid onboth sides of the support member assembly 260.

In one embodiment, the first housing structure 210 may include a firstrotary support surface 214, and the second housing structure 520 mayinclude a second rotary support surface 224 corresponding to the firstrotary support surface 214. The first rotary support surface 214 and thesecond rotary support surface 224 may include a curved surfacecorresponding to the curved surface included in the hinge cover 265.

In one embodiment, when the electronic device 200 is in the flat state(e.g., state of FIG. 2A), the first rotary support surface 214 and thesecond rotary support surface 224 may cover the hinge cover 265 so thatthe hinge cover 265 may be not or minimally exposed to the rear surfaceof the electronic device 200. When the electronic device 200 is in thefolded state (e.g., state of FIG. 2B), the first rotary support surface214 and the second rotary support surface 224 may rotate along thecurved surface included in the hinge cover 265 so that the hinge cover265 may be maximally exposed to the rear surface of the electronicdevice 200.

The antenna according to various embodiments of the disclosure may beapplied to the first housing structure, and may be configured to shiftin a relatively wide range of a low band without degrading radiationperformance. Next, a description is given of the antenna.

FIGS. 4A and 4B are a view of an electronic device illustrating thearrangement of conductive portions segmented by a single non-conductiveportion according to various embodiments of the disclosure.

Embodiments for the electronic device 400 of FIGS. 4A and 4B may be atleast partially similar to or different from those for the electronicdevice 200 of FIGS. 2A to 3 .

Referring to FIG. 4A, the electronic device 400 may include foldablehousing structures 410 and 420 rotatably arranged with respect to thefolding axis A. In one embodiment, the foldable housing structures mayinclude a first housing structure 410 and a second housing structure420. In one embodiment, the first housing structure 410 and the secondhousing structure 420 may be rotatably coupled via the hinge structure460 (e.g., hinge structure 264 in FIG. 3 ) having a hinge cover 465. Forexample, through the hinge structure 460, the first housing structure410 and the second housing structure 420 may be folded to face eachother with respect to the folding axis A, or may be unfolded to becoplanar.

In various embodiments, the first housing structure 410 may include afirst surface 411 facing in a first direction (e.g., Z-axis direction inFIG. 3 ), a second surface 412 facing in a second direction opposite tothe first direction (e.g., negative Z-axis direction in FIG. 3 ), and afirst side member 413 enclosing at least a portion of the space betweenthe first surface 411 and the second surface 412. In one embodiment, atleast a portion of the first side member 413 may be made of a conductivemember (e.g., metal member). In one embodiment, at least a portion ofthe conductive member of the first side member 413 may be applied as anantenna (A1). In one embodiment, the first side member 413 may include afirst conductive portion 4131, a first non-conductive portion 4132, anda second conductive portion 4133 arranged in sequence from the hingestructure 460.

In various embodiments, the second housing structure 420 may include athird surface 421 facing in a third direction (e.g., Z-axis direction inFIG. 3 ), a fourth surface 422 facing in a fourth direction opposite tothe third direction (e.g., negative Z-axis direction in FIG. 3 ), and asecond side member 423 enclosing at least a portion of the space betweenthe third surface 421 and the fourth surface 422. In one embodiment, atleast a portion of the second side member 423 may be made of aconductive member. In one embodiment, the second side member 423 mayinclude a third conductive portion 4231, a second non-conductive portion4232, a fourth conductive portion 4233, a third non-conductive portion4234, and/or a fifth conductive portion 4235 arranged in sequence fromthe hinge structure 460.

In various embodiments, when the first housing structure 410 and thesecond housing structure 420 are unfolded with 180 degrees, the firstsurface 411 and the third surface 421 may be formed to be of a planarshape facing the same direction (e.g., Z-axis direction in FIG. 3 ). Inone embodiment, the electronic device 400 may include a display 430disposed to cross the first surface 411 of the first housing structure410 and the third surface 421 of the second housing structure 420. Forexample, when the first housing structure 410 and the second housingstructure 420 are folded with respect to the folding axis A so that thefirst surface 411 and the third surface 421 face each other, the display430 may also be folded with respect to the folding axis A. In oneembodiment, the display 430 may be not disposed on at least a portion ofthe first surface 411 of the first housing structure 410 and a separatesensor region 435 may be disposed thereon. In another embodiment, thesensor region 435 may be disposed on at least a portion of the thirdsurface 421 of the second housing structure 420 or may be disposed on aportion extending to the first surface 411 and the third surface 421.

In various embodiments, the electronic device 400 may be provided withan antenna A1 formed using a portion (e.g., lower portion) of the firstside member 413 of the first housing structure 410. In one embodiment,the antenna A1 may be formed through the second conductive portion 4133segmented by the first non-conductive portion 4132 of the first sidemember 413. In this case, the second conductive portion 4133 may beformed to have an electrical length relatively longer than that of theantenna formed as the unit conductive portion by a pair ofnon-conductive portions. In another embodiment, the antenna A1 may bedisposed in an upper region of the first housing structure 410 or in aside region connecting the upper region and the lower region thereof.

In various embodiments of the disclosure, the antenna A1 may include apair of feeders disposed at different positions from the firstnon-conductive portion 4132, and may be configured to reduce thedegradation of the radiation performance in the low band and to shift ina relatively wide bandwidth through selective feeding of the feeders.

In one embodiment of the disclosure, the antenna A1 may be configured tooperate in a lower frequency band compared with the case of directfeeding by forming at least one of the pair of feeders through coupledfeeding although the second conductive portion 4133 has the sameelectrical length. In one embodiment, the antenna A1 may be configuredto shift the frequency in the range of 750 MHz to 1200 MHz in the lowband.

Referring to FIG. 4B, when the first housing structure 410 and thesecond housing structure 420 of the electronic device 400 are folded toface each other, the second non-conductive portion 4232 of the secondhousing structure 420 may be disposed to overlap with the firstnon-conductive portion 4132 of the first housing structure 410 when thesecond surface 412 of the first housing structure 410 is viewed from thetop. In one embodiment, when the electronic device 400 is folded, thefourth conductive portion 4333 of the second housing structure 420 mayreduce the radiation performance of the antenna (antenna A1 in FIG. 4A)formed by the second conductive portion 4133. For example, if the fourthconductive portion 4333 has an electrical length that is the same orsimilar to the operating frequency band of the second conductive portion4133, the current applied to the second conductive portion 4133 mayinduce an unwanted current in the fourth conductive portion 4333, andthis unwanted current may cause parasitic resonance that degrades theradiation performance of the second conductive portion 4133. To preventthis problem, the fourth conductive portion 4333 of the second housingstructure 420 may be segmented by the second non-conductive portion 4132and the third non-conductive portion 4234 into a unit conductive portion(fourth conductive portion 4333), and the fourth conductive portion 4333being a unit conductive portion may be induced to be out-band outsidethe operating frequency band of the second conductive portion 4133. Inanother embodiment, the third non-conductive portion 4234 may bedisposed at various positions to prevent interference to the operatingfrequency band of the second conductive portion 4133.

FIG. 5 is a view of an electronic device illustrating the arrangement ofthe antenna according to various embodiments of the disclosure. FIGS. 6Aand 6B illustrate the configuration of the variable elements T1 and T2shown in FIG. 5 according to an embodiment of the disclosure.

FIG. 5 illustrates the configuration of the antenna A1 when the secondsurface of the first housing structure 410 (e.g., second surface 412 inFIG. 4A) is viewed from above.

Referring to FIG. 5 , the electronic device 400 may include a firsthousing structure 410 and a second housing structure 420 rotatablydisposed with respect to each other. In one embodiment, the firsthousing structure 410 and the second housing structure 420 may berotatably connected via the hinge structure 460. For example, the firsthousing structure 410 and the second housing structure 420 are notseparated from each other due to the hinge structure 460 and may befolded to face each other or be unfolded to be coplanar.

In various embodiments, the first housing structure 410 may include afirst surface 411 facing in a first direction (e.g., Z-axis direction inFIG. 3 ), a second surface 412 facing in a second direction opposite tothe first direction (e.g., negative Z-axis direction in FIG. 3 ), and afirst side member 413 enclosing at least a portion of the space 4001between the first surface 411 and the second surface 412. In oneembodiment, the first side member 413 may include a first conductiveportion 4131, a first non-conductive portion 4132, and a secondconductive portion 4133 arranged in sequence from the hinge structure460.

In various embodiments, the first side member 413 may include a firstconnection piece 4134 formed at a first position L1 and/or a secondconnection piece 4135 formed at a second position L2 from the firstnon-conductive portion 4132. The second position L2 may be closer to thefirst non-conductive portion 4132 than the first position L1. In oneembodiment, the first connection piece 4134 and the second connectionpiece 4135 may each be formed as a single body with the first sidemember 413. For example, the first connection piece 4134 and the secondconnection piece 4135 may be disposed to overlap with at least a portionof the printed circuit board 470 disposed in a region of the space 4001formed by the first side member 413.

In various embodiments, the electronic device 400 may include theprinted circuit board 470 disposed in the internal space 4001 of thefirst side member 413. In one embodiment, the printed circuit board 470may include a first connection portion 471 (e.g., conductive pad)electrically connected to the first connection piece 4134. For example,the first connection piece 4134 may be electrically connected to thefirst connection portion 471 of the printed circuit board 470 as theprinted circuit board 470 is mounted in the space 4001. Alternatively,the first connection piece 4134 may be electrically connected to thefirst connection portion 471 of the printed circuit board 470 through aseparate electrical connection part (e.g., C clip or conductivecontact). In one embodiment, the printed circuit board 470 may include afirst electrical path 4701 (e.g., wiring line) ranging from the firstconnection portion 471 to a first feeder 472 (e.g., wirelesscommunication circuit). In one embodiment, the first feeder 472 maytransmit a first signal of a first frequency band at the first positionL1 of the second conductive portion 4133 electrically connected throughthe first electrical path 4701. Here, the first frequency band may be inthe range of about 900 MHz to 1200 MHz.

FIGS. 6A and 6B illustrate the configuration of the variable elements T1and T2 shown in FIG. 5 according to various embodiments of thedisclosure.

Referring to FIG. 6A, in various embodiments, a first variable elementT1 may be disposed in the middle of the first electrical path 4701. Inone embodiment, the first variable element T1 may include a tuner thatincludes a first terminal C1 electrically connected to the firstelectrical path 4701, a second terminal C2 electrically connected to theground layer G of the printed circuit board 470, and a third terminal C3electrically connected to the first position L1 of the second conductiveportion 4133. In another embodiment, the first variable element T1 mayinclude a plurality of passive elements for selective switching. In oneembodiment, because the printed circuit board 470 is in directelectrical contact with the first housing structure 410 constituting theexternal appearance of the electronic device 400, an electric shockprevention circuit 473 may be further included in the first electricalpath 4701 to prevent electric shock caused by electrostatic discharge(ESD).

In various embodiments, the printed circuit board 470 may include asecond connection portion 474 electrically connected to the secondconnection piece 4135. In one embodiment, the second connection piece4135 and the printed circuit board 470 may be electrically connected tothe second connection portion 474 of the printed circuit board 470 viacoupled feeding. As the second conductive portion 4133 is electricallyconnected to the printed circuit board 470 through coupled feeding, thecapacitor configuration between conductors makes the electrical lengthof the second conductive portion 4133 longer, thereby extending thefrequency shift range in the low band. In one embodiment, the printedcircuit board 470 may include a second electrical path 4702 (e.g.,wiring line) ranging from the second connection portion 474 to a secondfeeder 475 (e.g., wireless communication circuit). In one embodiment,the second feeder 475 may transmit a second signal of a second frequencyband at the second position L2 of the second conductive portion 4133electrically connected through the second electrical path 4702. Here,the second frequency band may be in the range of about 750 MHz to 850MHz.

Referring to FIG. 6B, in various embodiments, a second variable elementT2 may be disposed in the middle of the second electrical path 4702. Inone embodiment, the second variable element T2 may include a switch thatincludes a fourth terminal C4 electrically connected to the secondelectrical path 4702, a fifth terminal C5 electrically connected to theground layer G of the printed circuit board 470, and a sixth terminal C6coupled to the second position L2 of the second conductive portion 4133.In another embodiment, the second variable element T2 may include aplurality of passive elements or tunable ICs for selective switching. Inone embodiment, because the printed circuit board 470 is in directelectrical contact with the first housing structure 410 constituting theexternal appearance of the electronic device 400, an electric shockprevention circuit 476 may be further included in the second electricalpath 4702 to prevent electric shock caused by electrostatic discharge(ESD).

In various embodiments, the printed circuit board 470 in region B mayinclude a third electrical path (e.g., third electrical path 4703 inFIG. 7A) and/or a fourth electrical path (e.g., fourth electrical path4704 in FIG. 7B) electrically connecting the second position L2 of thesecond conductive portion 4133 and the second variable element T2.

In various embodiments, the first side member 413 may include a thirdconnection piece 4136 disposed at a third position L3. In oneembodiment, the third connection piece 4136 may be formed to extend fromthe first side member 413 toward the space 4001. In one embodiment, theprinted circuit board 470 may include a third connection portion 477(e.g., conductive pad) electrically connected to the third connectionpiece 4136. For example, the third connection piece 4136 may beelectrically connected to the third connection portion 477 of theprinted circuit board 470 as the printed circuit board 470 is mounted inthe space 4001. Alternatively, the third connection piece 4136 may beelectrically connected to the third connection portion 477 of theprinted circuit board 470 through a separate electrical connection part(e.g., C clip or conductive contact). In one embodiment, the printedcircuit board 470 may include a fifth electrical path 4705 (e.g., wiringline) ranging from the third connection portion 477 to the ground layerG of the printed circuit board 470. In one embodiment, the printedcircuit board 470 may include an electric shock prevention capacitor 478in the middle of the fifth electrical path 4705.

In various embodiments, the antenna (e.g., antenna A1 in FIG. 4A) may beshifted in various ranges of the low band through selective feeding ofthe first feeder 472 and/or the second feeder 475 with the secondconductive portion 4133 of the first side member 413 and throughimpedance matching using the first variable element T1 and/or the secondvariable element T2. For example, feeding through the second feeder 475coupled with the second conductive portion 4133 enables the antenna toperform shifting in a wider frequency range of the low band with areduction in radiation performance degradation.

In various embodiments, the processor 480 of the electronic device 400may collect state information of the electronic device (e.g., localinformation, channel information, voice or data communicationinformation, grip information, or proximity information) through atleast one sensor, and determine the current mode based on the collectedstate information. The processor 480 may control the first variableelement T1 and/or the second variable element T2 according to thedetermined mode to thereby change the operating frequency range of thesecond conductive portion 4133 in the low band. For example, through thefirst variable element T1 and/or the second variable element T2, theprocessor 480 may control the antenna radiator utilizing the secondconductive portion 4133 to selectively operate at various operatingfrequencies of the low band (e.g., 750 MHz to 1200 MHz) withoutradiation performance degradation.

FIGS. 7A and 7B illustrate the electrical connection between a secondconnection piece and a printed circuit board according to variousembodiments of the disclosure.

FIGS. 7A and 7B are cross-sectional views of a region B where the secondfeeder 475 and the second conductive portion 4133 are coupled fed.

Referring to FIG. 7A, the printed circuit board 470 may include a thirdelectrical path 4703 electrically connecting the second position (e.g.,second position L2 in FIG. 5 ) of the second conductive portion 4133 andthe second variable element (e.g., second variable element T2 in FIG. 5). In one embodiment, the printed circuit board 470 may include a firstsubstrate surface 470 a and a second substrate surface 470 b facing awayfrom the first substrate surface 470 a. In one embodiment, the printedcircuit board 470 may include a first region 4706 (e.g., ground layer)and a second region 4707 (e.g., fill-cut region). In one embodiment, theprinted circuit board 470 may include, when a first conductive pad 4472disposed on the first substrate surface 470 a in the second region 4707and the first substrate surface 470 a are viewed from above, a secondconductive pad 4471 that is formed on the second substrate surface 470 bso as to at least partially overlap with the first conductive pad 4472(e.g., second connection portion 474 in FIG. 5 ). In one embodiment, thefirst conductive pad 4472 may be electrically connected to the secondfeeder 475 through the second electrical path 4702 formed in the printedcircuit board 470. In one embodiment, the second conductive pad 4471 maybe electrically connected to the second connection piece 4135 extendingfrom the second conductive portion 4133 of the first side member 413through an electrical connection member 4477. In one embodiment, theelectrical connection member 4743 may be in physical contact with thesecond connection piece 4135 and the second conductive pad 4741.

In various embodiments, the first conductive pad 4742 and the secondconductive pad 4741 spaced apart by a first interval d1 in the printedcircuit board 470 may be operated as a capacitor configuration. In oneembodiment, the capacitance of the capacitor configuration may bedetermined according to the overlapping area between the firstconductive pad 4742 and the second conductive pad 4741, and thusimpedance matching of the antenna may be achieved.

Referring to FIG. 7B, the capacitance may be determined by adjusting thespacing between the first conductive pad 4742 and the second conductivepad 4741. In one embodiment, the printed circuit board 470 may include afourth electrical path 4704 electrically connecting the second position(e.g., second position L2 in FIG. 5 ) of the second conductive portion4133 and the second variable element (e.g., second variable element T2in FIG. 5 ). In one embodiment, the printed circuit board 470 mayinclude a third conductive pad 4744 disposed between the firstconductive pad 4742 and the second conductive pad 4741. In oneembodiment, the third conductive pad 4744 may be formed as a pattern onone of the dielectric layers 470 c of the printed circuit board 470. Inone embodiment, the third conductive pad 4744 may be electricallyconnected to the second conductive pad 4741 through at least oneconductive via 4745. Hence, the second interval d2 between the thirdconductive pad 4744 and the first conductive pad 4742 for a capacitorconfiguration may be less than the first interval d1. This may beadvantageous for determining the specified capacitance when the mountingspace of the conductive pads 4742 and 4741 is insufficient.

FIG. 8A is a return loss (S11) chart illustrating changes in theoperating band of the antenna due to adjustment of the first feeder andthe second feeder according to an embodiment of the disclosure.

Referring to FIG. 8A, the following can be seen from the chart. Theantenna having the configuration shown in FIG. 5 operates at a lowfrequency (e.g., about 750 MHz) in a low band when the second feeder(e.g., second feeder 475 in FIG. 5 ) is the default (graph 801). Whenthe second feeder (e.g., second feeder 475 in FIG. 5 ) is the defaultand the first feeder (e.g., first feeder 472 in FIG. 5 ) is tunedthrough the first variable element (e.g., first variable element T1 inFIG. 5 ), the antenna shifts to a higher frequency (e.g., about 850 MHz)(graph 802). When the first feeder (e.g., first feeder 472 in FIG. 5 )is the default, the antenna shifts to a higher frequency (e.g., about950 MHz) (graph 803). When the first feeder (e.g., first feeder 472 inFIG. 5 ) is the default and the second feeder (e.g., second feeder 475in FIG. 5 ) is tuned through the second variable element (e.g., secondvariable element T2 in FIG. 5 ), the antenna shifts to a higherfrequency (e.g., about 1170 MHz) (graph 804). Hence, when a pair offeeders (e.g., first feeder 472 and second feeder 475 in FIG. 5 ) areprovided at different positions of one conductive portion (e.g., secondconductive portion 4133 in FIG. 5 ) and coupled feeding is applied toone of the feeders (e.g., second feeder 475 in FIG. 5 ), it can be seenthat the frequency band shifts in the range of about 750 MHz to 1200 MHzin the low band.

FIG. 8B is a chart illustrating performance of the antenna for eachoperating band due to adjustment of the first feeder and the secondfeeder according to an embodiment of the disclosure.

Referring to FIG. 8B, for the antenna having the configuration shown inFIG. 5 , graph 805 indicates a case where the second feeder (e.g.,second feeder 475 in FIG. 5 ) is the default. Graph 806 indicates a casewhere the second feeder (e.g., second feeder 475 in FIG. 5 ) is thedefault and the first feeder (e.g., first feeder 472 in FIG. 5 ) istuned through the first variable element (e.g., first variable elementT1 in FIG. 5 ). Graph 807 indicates a case where the first feeder (e.g.,first feeder 472 in FIG. 5 ) is the default. It can be seen that even ifthe frequency shifts in the direction toward higher frequencies, theefficiency (radiation performance) is not lowered as indicated by thecircular dotted line.

FIGS. 9A and 9B are perspective views of the electronic device viewedfrom different angles according to various embodiments of thedisclosure.

Embodiments for the electronic device of FIGS. 9A and 9B may be at leastpartially similar to or different from those for the electronic device101 of FIG. 1 .

The antenna structure according to the various embodiments of thedisclosure is applied to a folder type electronic device as describedabove, but it may also be applied to a bar type electronic device asdescribed below.

Referring to FIGS. 9A and 9B, the electronic device 900 may include afirst surface (or front surface) 910A, a second surface (or rearsurface) 910B, and a housing 910 including a side surface 910C enclosingthe space between the first surface 910A and the second surface 910B. Ina different embodiment, the housing may refer to a structure formingsome of the first surface 910A, the second surface 910B, and the sidesurface 910C shown in FIG. 1 . In one embodiment, at least a portion ofthe first surface 910A may be made of a substantially transparent frontplate 902 (e.g., glass plate or polymer plate including various coatinglayers). The second surface 910B may be made of a substantially opaquerear plate 911. The rear plate 911 may be made of, for example, coatedor colored glass, ceramic, polymer, metal (e.g., aluminum, stainlesssteel (STS), or magnesium), or a combination thereof. The side surface910C is coupled to the front plate 902 and the rear plate 911, and maybe made of a side member 920 (or “side bezel structure”) containingmetal and/or polymer. In a certain embodiment, the rear plate 911 andthe side member 920 may be formed as a single body, and may contain thesame material (e.g., metal material such as aluminum).

In the illustrated embodiment, the front plate 902 may include a firstregion 910D, which is curved and seamlessly extended from the firstsurface 910A toward the rear plate, at both ends of the long edge. Inthe illustrated embodiment (FIG. 9B), the rear plate 911 may include asecond region 910E, which is curved and seamlessly extended from thesecond surface 910B toward the front plate, at both ends of the longedge. In one embodiment, the front plate 902 or the rear plate 911 mayinclude only one of the first region 910D and the second region 910E. Ina certain embodiment, the front plate 902 may include only a flat planedisposed parallel to the second surface 910B without including the firstregion or the second region. In the above embodiments, when viewed fromthe side of the electronic device, the side bezel structure 918 may havea first thickness (or width) on the side where the first region 910D orthe second region 910E is not included, and may have a second thicknessless than the first thickness on the side where the first region or thesecond region is included.

In one embodiment, the electronic device 900 may include one or more ofa display 901, an input unit 903, a sound output unit 907 or 914, asensor module 904 or 919, a camera module 905, 912 or 913, a key inputunit 917, an indicator 916, and a connector 908 or 909. In anotherembodiment, at least one of the components (e.g., key input unit 917 orindicator 906) of the electronic device 900 may be omitted, or a newcomponent may be added to the electronic device 900.

The display 901 may be exposed through a substantial portion of frontplate 902. In one embodiment, at least a portion of the display 901 maybe exposed through the front plate 902 forming the first surface 910Aand a first region 910D of the side surface 910C. The display 901 may bedisposed in combination with or adjacent to the touch sensing circuit,the pressure sensor capable of measuring the strength (pressure) of atouch, and/or the digitizer for detecting a magnetic stylus pen. In oneembodiment, at least a portion of the sensor module 904 or 919 and/or atleast a portion of the key input unit 917 may be disposed in the firstregion 910D and/or the second region 910E.

The input unit 903 may include a microphone 903. The input device 903may include a plurality of microphones 903 arranged to identify thedirection of a sound. The sound output unit 907 or 914 may includespeakers 907 and 914. The speakers 907 and 914 may include an externalspeaker 907 and a call receiver 914. In one embodiment, the microphone903, the speakers 907 and 914, and the connectors 908 and 909 may bedisposed in the above space of the electronic device 900 and may beexposed to the external environment through at least one hole formed inthe housing 910. In one embodiment, the hole formed in the housing 910may be commonly used for the microphone 903 and the speakers 907 and914. The sound output unit 907 or 914 may include a speaker (e.g. piezospeaker) that operates without using the hole formed in the housing 910.

The sensor module 904 or 919 may generate an electric signal or datavalue corresponding to the operating state of the electronic device 900or the external environmental state. The sensor modules 904 and 919 mayinclude, for example, a first sensor module 904 (e.g., proximity sensor)disposed on the first surface 910A of the housing 910, a second sensormodule (not shown) (e.g., fingerprint sensor), and/or a third sensormodule 919 (e.g., HRM sensor) disposed on the second surface 910B of thehousing 910. The fingerprint sensor may be disposed below the firstsurface 910A (e.g., home key button 915) of the housing 910, at aportion of the second surface 910B, or below the display 901. Theelectronic device 900 may further include at least one of, for example,a gesture sensor, a gyro sensor, an air pressure sensor, a magneticsensor, an acceleration sensor, a grip sensor, a color sensor, aninfrared sensor, a biometric sensor, a temperature sensor, a humiditysensor, or an illuminance sensor (not shown).

The camera module 905, 912 and 913 may include a first camera 905disposed on the first surface 910A of the electronic device 900, asecond camera 912 disposed on the second surface 910B, and/or a flash913. The camera module 905 or 912 may include one or more lenses, animage sensor, and/or an image signal processor. The flash 913 mayinclude, for example, a light emitting diode or a xenon lamp. In acertain embodiment, two or more lenses (wide angle and telephoto lenses)and image sensors may be disposed on one surface of the electronicdevice 900.

The key input unit 917 may be disposed on the side surface 910C of thehousing 910. In another embodiment, the key input unit 917 of theelectronic device 900 may include soft keys implemented on the display901 without including physical keys. In one embodiment, the key inputunit 917 may be implemented using a pressure sensor embedded in thedisplay 901.

The indicator 906 may be disposed, for example, on the first surface910A of the housing 910. The indicator 906 may provide, for example,state information of the electronic device 900 in the form of light. Inanother embodiment, the indicator 906 may provide, for example, a lightsource linked to operations of the camera module 905. The indicator 906may include, for example, an LED, an IR LED, or a xenon lamp.

The connector holes 908 and 909 may include a first connector hole 908to accommodate a connector (e.g., USB connector) for transmitting andreceiving power and/or data to and from an external electronic device,and a second connector hole 909 (or, earphone jack) to accommodate aconnector for transmitting and receiving an audio signal to and from anexternal electronic device.

In various embodiments, at least a portion of the side member 920 may bemade of a conductive member (e.g., metal member). In one embodiment, theside member 920 may include a first conductive portion 921, a secondconductive portion 922, and a non-conductive portion 923 formed betweenthe first conductive portion 921 and the second conductive portion 922.In one embodiment, the antenna C of the disclosure may be formed byusing the first conductive portion 921 segmented by the non-conductiveportion 923.

FIG. 10 illustrates the arrangement of the antenna in the electronicdevice shown in FIG. 9A according to an embodiment of the disclosure.

Referring to FIG. 10 , in various embodiments, the side member 920 mayinclude a first connection piece 9211 formed at a first position L1 anda second connection piece 9212 formed at a second position L2 from thenon-conductive portion 923. The second position L2 may be closer to thenon-conductive portion 923 than the first position L1. In oneembodiment, the first connection piece 9211 and the second connectionpiece 9212 may each be formed as a single body with the side member 920.In one embodiment, the first connection piece 9211 and the secondconnection piece 9212 may be disposed to overlap with at least a portionof the printed circuit board 970 disposed in a region of the space 9001formed by the side member 920.

In various embodiments, the electronic device 900 may include theprinted circuit board 970 disposed in the internal space 9001 of theside member 920. In one embodiment, the printed circuit board 970 mayinclude a first connection portion 971 (e.g., conductive pad)electrically connected to the first connection piece 9211. In oneembodiment, the printed circuit board 970 may include a first electricalpath 9701 (e.g., wiring line) ranging from the first connection portion971 to a first feeder 972 (e.g., wireless communication circuit). In oneembodiment, the first feeder 972 may transmit a first signal of a firstfrequency band at the first position L1 of the first conductive portion921 electrically connected through the first electrical path 9701. Thefirst frequency band may be in the range of about 900 MHz to 1200 MHz.In one embodiment, a first variable element T1 may be disposed in themiddle of the first electrical path 9701. In one embodiment, the firstvariable element T1 may have a configuration substantially the same asthat shown in FIG. 6A. In another embodiment, the first variable elementT1 may include a plurality of passive elements for selective switching.In one embodiment, because the printed circuit board 470 is in directelectrical contact with the side member 920 constituting the externalappearance of the electronic device 900, an electric shock preventioncircuit 973 may be further included in the first electrical path 9701 toprevent electric shock caused by electrostatic discharge (ESD).

In various embodiments, the printed circuit board 970 may include asecond connection portion 974 electrically connected to the secondconnection piece 9212. In one embodiment, the second connection piece9212 and the printed circuit board 970 may be electrically connected tothe second connection portion 974 of the printed circuit board 970 viacoupled feeding. This connection configuration (region B) issubstantially similar to that of FIG. 7A or 7B, and a descriptionthereof will be omitted. In one embodiment, the printed circuit board970 may include a second electrical path 9702 (e.g., wiring line)ranging from the second connection portion 974 to a second feeder 975(e.g., wireless communication circuit). In one embodiment, the secondfeeder 975 may transmit a second signal of a second frequency band atthe second position L2 of the first conductive portion 921 electricallyconnected through the second electrical path 9702. The second frequencyband may be in the range of about 750 MHz to 850 MHz. In one embodiment,a second variable element T2 may be disposed in the middle of the secondelectrical path 9702. The second variable element T2 may have aconfiguration substantially the same as that shown in FIG. 6B. Inanother embodiment, the second variable element T2 may include aplurality of passive elements or tunable ICs for selective switching. Inone embodiment, because the printed circuit board 970 is in directelectrical contact with the side member 920 constituting the externalappearance of the electronic device 900, an electric shock preventioncircuit 976 may be further included in the second electrical path 9702to prevent electric shock caused by electrostatic discharge (ESD).

In various embodiments, the side member 920 may include a thirdconnection piece 9213 disposed at a third position L3. In oneembodiment, the third connection piece 9213 may be formed to extend fromthe side member 920 toward the space 9001. In one embodiment, theprinted circuit board 970 may include a third connection portion 977(e.g., conductive pad) electrically connected to the third connectionpiece 9213. In one embodiment, the printed circuit board 970 may includea third electrical path 9703 (e.g., wiring line) ranging from the thirdconnection portion 977 to the ground layer G of the printed circuitboard 970. In one embodiment, the printed circuit board 970 may includean electric shock prevention capacitor 978 in the middle of the thirdelectrical path 9703.

In various embodiments, the antenna (e.g., antenna C in FIG. 9A) may beshifted in various ranges of the low band through selective feeding ofthe first feeder 972 and/or the second feeder 975 with the firstconductive portion 921 of the side member 920 and through impedancematching using the first variable element T1 and/or the second variableelement T2. For example, feeding through the second feeder 975 coupledwith the first conductive portion 921 enables the antenna to performshifting in a wider frequency range of the low band with a reduction inradiation performance degradation. In one embodiment, to monitor thesurrounding environment and to operate the antenna in the frequency bandcorresponding to the monitored environment, the electronic device 900may include at least one processor 980 to control the first variableelement T1 and/or the second variable element T2.

FIG. 11 illustrates a case where the antenna is applied to a wearableelectronic device 1100 according to an embodiment of the disclosure.

Referring to FIG. 11 , the electronic device 1100 may include a housing1110 (e.g., metal bezel), a first fastening member 1120 fastened to oneside of the housing 1110, and a second fastening member 1130 fastened tothe other side of the housing 1110 and having at least one fastener1135. In one embodiment, the electronic device 1100 may include aprinted circuit board 1140 mounted in the internal space of the housing1110. In one embodiment, the electronic device 1100 may include at leastone feeder 1121 and 1131 (e.g., wireless communication circuit) mountedat a portion of the printed circuit board 1140.

In various embodiments, at least a portion of the housing 1110 may bemade of a conductive member (e.g., metal member). In one embodiment, thehousing 1110 may include a first conductive portion 1111 formed at aportion of the conductive member region, a second conductive portion1112, and a non-conductive portion 1113 formed between the firstconductive portion 1111 and the second conductive portion 1112. Thehousing 1110 may be utilized as a conductive side member. The firstconductive portion 1111 may be electrically connected to the firstfeeder 1121 at a first position L1 through a first electrical path 1101,and may be electrically connected to the second feeder 1131 at a secondposition L2 through a second electrical path 1102. In one embodiment, afirst variable element T1 1122 and a second variable element T2 1132having the same configuration as described above may be disposed in themiddle of the first electrical path 1101 and the second electrical path1102, respectively. In one embodiment, the printed circuit board 1140and the first conductive portion 1111 may be coupled fed at the secondposition L2. The first conductive portion 1111 used as an antenna may beselectively fed with the first feeder 1121 and/or the second feeder1131, and may be shifted in various ranges of the low band throughimpedance matching using the first variable element T1 and/or the secondvariable element T2. For example, feeding through the second feeder 1131coupled with the first conductive portion 1111 enables the antenna toperform shifting in a wider frequency range of the low band with areduction in radiation performance degradation. In one embodiment, tomonitor the surrounding environment and to operate the antenna in thefrequency band corresponding to the monitored environment, theelectronic device 1100 may include at least one processor (not shown) tocontrol the first variable element T1 and/or the second variable elementT2.

In various embodiments, as described above, the antenna of thedisclosure where a pair of feeders are provided to one conductiveportion and coupled feeding is applied to one of the feeders is appliedto, but not limited to, a folder type electronic device (e.g.,electronic device 400 in FIG. 4A), a bar type electronic device (e.g.,electronic device 900 in FIG. 9A), and a wearable type electronic device(e.g., electronic device 1100 in FIG. 11 ). For example, the antennastructure of the disclosure can be applied to various electronic deviceshaving a housing, a bezel, a side support structure, or a side memberincluding a conductive portion. Such electronic devices may havedifferent shapes or different operating mechanisms.

In various embodiments of the disclosure, the antenna is implementedthrough direct feeding and coupled feeding at different locations of theconductive portion including a single non-conductive portion. Hence, itis possible for the antenna to shift to a specified frequency range inthe low band without compromising performance over a relatively widebandwidth.

According to various embodiments of the disclosure, the electronicdevice (e.g., electronic device 400 in FIG. 4A) may include: a foldablehousing including: a hinge structure (e.g., hinge structure 460 in FIG.4A); a first housing structure (e.g., first housing structure 410 inFIG. 4A) connected to the hinge structure and including a first surface(e.g., first surface 411 in FIG. 4A) facing in a first direction, asecond surface (e.g., second surface 412 in FIG. 4A) facing in a seconddirection opposite to the first direction, and a first side member(e.g., first side member 413 in FIG. 4A) enclosing at least a portion ofthe space between the first surface and the second surface (e.g., space4001 in FIG. 5 ) and including a first conductive portion (e.g., firstconductive portion 4131 in FIG. 4A), a first non-conductive portion(e.g., first non-conductive portion 4132 in FIG. 4A), and a secondconductive portion (e.g., second conductive portion 4133 in FIG. 4A)arranged in sequence from the hinge structure; and a second housingstructure (e.g., second housing structure 420 in FIG. 4A) connected tothe hinge structure and foldable with the first housing structure withrespect to the hinge structure, and including a third surface (e.g.,third surface 421 in FIG. 4A) facing in a third direction, a fourthsurface (e.g., fourth surface 422 in FIG. 4A) facing in a fourthdirection opposite to the third direction, and a second side member(e.g., second side member 423 in FIG. 4A) enclosing at least a portionof the space between the third surface and the fourth surface andincluding a third conductive portion (e.g., third conductive portion4231 in FIG. 4A), a second non-conductive portion (e.g., secondnon-conductive portion 4232 in FIG. 4A), a fourth conductive portion(e.g., fourth conductive portion 4333 in FIG. 4A), a thirdnon-conductive portion (e.g., third non-conductive portion 4234 in FIG.4A), and a fifth conductive portion (e.g., fifth conductive portion 4235in FIG. 4A) arranged in sequence from the hinge structure, wherein thefirst surface may face the third surface in the folded state and thethird direction may be the same as the first direction in the unfoldedstate; a flexible display (e.g., display 430 in FIG. 4A) extending fromthe first surface to the third surface; a printed circuit board (e.g.,printed circuit board 470 in FIG. 5 ) disposed between the first surfaceand the second surface and including at least one ground layer; at leastone wireless communication circuit (e.g., first feeder 472 or secondfeeder 475 in FIG. 5 ) disposed in the printed circuit board andincluding a first electrical path (e.g. first electrical path 4701 inFIG. 5 ) carrying a first signal of a first frequency band and a secondelectrical path (e.g., second electrical path 4702 in FIG. 5 ) carryinga second signal of a second frequency band; a first variable element(e.g., first variable element T1 in FIG. 5 ) including a first terminal(e.g., first terminal C1 in FIG. 6A) electrically connected to the firstelectrical path, a second terminal (e.g., second terminal C2 in FIG. 6A)electrically connected to the ground layer (e.g., ground layer G in FIG.5 ), and a third terminal (e.g., third terminal C3 in FIG. 6A)electrically connected to a first position (e.g., first position L1 inFIG. 5 ) of the second conductive portion; and a second variable element(e.g., second variable element T2 in FIG. 5 ) including a fourthterminal (e.g., fourth terminal C4 in FIG. 6B) electrically connected tothe second electrical path, a fifth terminal (e.g., fifth terminal C5 inFIG. 6B) electrically connected to the ground layer, and a sixthterminal (e.g., sixth terminal C6 in FIG. 6B) electrically connected toa third electrical path (e.g., third electrical path 4703 in FIG. 7A)connected to a second position (e.g., second position L2 of FIG. 5 ) ofthe second conductive portion, the second position being closer to thefirst non-conductive portion than the first position.

In various embodiments, the first non-conductive portion (e.g., firstnon-conductive portion 4132 in FIG. 4A) may at least partially overlapthe second non-conductive portion (e.g., second non-conductive portion4232 in FIG. 4A) when viewed from above the first surface in the foldedstate.

In various embodiments, the first frequency band may include frequenciesin the range of about 900 MHz to about 1200 MHz, and the secondfrequency band may include frequencies in the range of about 750 MHz toabout 850 MHz.

In various embodiments, the third electrical path may include at leastone conductive pattern (e.g., first conductive pad 4742 in FIG. 7A)coupled with the second position through a dielectric (e.g.,non-conductive portion 4707 in FIG. 7A).

In various embodiments, the third electrical path may further include aflexible connection member (e.g., electrical connection member 4743 inFIG. 7A) between the conductive pattern and the second position.

In various embodiments, the first variable element may include a tuner.

In various embodiments, the second variable element may include aswitch.

In various embodiments, a third position (e.g., third position L3 inFIG. 5 ) of the second conductive portion farther than the firstposition from the first non-conductive portion may be electricallyconnected to the ground layer of the printed circuit board through afourth electrical path (e.g., fifth electrical path 4705 in FIG. 5 ).

According to various embodiments of the disclosure, the electronicdevice (e.g., electronic device 900 in FIG. 9A) may include: a housing(e.g., housing 910 in FIG. 9A) including a first plate (e.g., firstplate 902 in FIG. 9A), a second plate (e.g., second plate 911 in FIG.9B) facing away from the first plate, and a side member (e.g., sidemember 920 in FIG. 9A) enclosing the space (e.g., space 9001 in FIG. 10) between the first plate and the second plate and connected to thesecond plate or formed as a single body with the second plate, whereinthe side member may include a first conductive portion (e.g., firstconductive portion 921 in FIG. 10 ), a second conductive portion (e.g.,second conductive portion 922 in FIG. 10 ), and a non-conductive portion(e.g., non-conductive portion 923 in FIG. 10 ) formed between the firstconductive portion and the second conductive portion, wherein the firstconductive portion may include a first position (e.g., first position L1in FIG. 10 ) and a second position (e.g. second position L2 in FIG. 10 )closer to the non-conductive portion than the first position; a printedcircuit board (e.g., printed circuit board 970 in FIG. 10 ) disposedbetween the first plate and the second plate and including at least oneground layer (e.g., ground layer Gin FIG. 10 ); at least one wirelesscommunication circuit (e.g., first feeder 972 or second feeder 975 inFIG. 10 ) disposed in the printed circuit board, and including a firstelectrical path (e.g., first electrical path 9701 in FIG. 10 ) carryinga first signal of a first frequency band and a second electrical path(e.g., second electrical path 9702 in FIG. 10 ) carrying a second signalof a second frequency band; a first variable element (e.g., firstvariable element T1 in FIG. 10 ) including a first terminal (e.g., firstterminal C1 in FIG. 6A) electrically connected to the first electricalpath, a second terminal (e.g., second terminal C2 in FIG. 6A)electrically connected to the ground layer, and a third terminal (e.g.,third terminal C3 in FIG. 6A) electrically connected to the firstposition; and a second variable element (e.g., second variable elementT2 in FIG. 10 ) including a fourth terminal (e.g., fourth terminal C4 inFIG. 6B) electrically connected to the second electrical path, a fifthterminal (e.g., fifth terminal C5 in FIG. 6B) electrically connected tothe ground layer, and a sixth terminal (e.g., sixth terminal C6 in FIG.6B) electrically connected to a third electrical path connected to thesecond position (e.g., second position L2 in FIG. 10 ).

In various embodiments, the first frequency band may include frequenciesin the range of about 900 MHz to about 1200 MHz, and the secondfrequency band may include frequencies in the range of about 750 MHz toabout 850 MHz.

In various embodiments, the third electrical path may include at leastone conductive pattern (e.g., first conductive pad 4742 in FIG. 7A)coupled with the second position through a dielectric (e.g.,non-conductive portion 4707 in FIG. 7A).

In various embodiments, the third electrical path may further include aflexible connection member (e.g., electrical connection member 4743 inFIG. 7A) between the conductive pattern and the second position.

In various embodiments, the first variable element may include a tuner.

In various embodiments, the second variable element may include aswitch.

In various embodiments, a third position (e.g., third position L3 inFIG. 10 ) of the first conductive portion (e.g., first conductiveportion 921 in FIG. 10 ) farther than the first position from thenon-conductive portion may be electrically connected to the ground layerof the printed circuit board through a fourth electrical path (e.g.,fourth electrical path 9703 in FIG. 5 ).

According to various embodiments of the disclosure, the electronicdevice (e.g., electronic device 900 in FIG. 9A) may include: a housing(e.g., housing 910 in FIG. 9A) including a first plate (e.g., firstplate 902 in FIG. 9A), a second plate (e.g., second plate 911 in FIG.9B) facing away from the first plate, and a side member (e.g., sidemember 920 in FIG. 9A) enclosing the space (e.g., space 9001 in FIG. 10) between the first plate and the second plate, wherein the side membermay include a first conductive portion (e.g., first conductive portion921 in FIG. 9A), a second conductive portion (e.g., second conductiveportion 922 in FIG. 9A), and a non-conductive portion (e.g.,non-conductive portion 923 in FIG. 9A) formed between the firstconductive portion and the second conductive portion, wherein the firstconductive portion may include a first position (e.g., first position L1in FIG. 9A) and a second position (e.g. second position L2 in FIG. 9A)closer to the non-conductive portion than the first position; a printedcircuit board (e.g., printed circuit board 970 in FIG. 10 ) disposedbetween the first plate and the second plate and including at least oneground layer (e.g., ground layer Gin FIG. 10 ); at least one wirelesscommunication circuit (e.g., first feeder 972 or second feeder 975 inFIG. 10 ) disposed in the printed circuit board and including a firstelectrical path (e.g., first electrical path 9701 in FIG. 10 )electrically connected to the first conductive portion at the firstposition and carrying a first signal of a first frequency band, and asecond electrical path (e.g., second electrical path 9702 in FIG. 10 )electrically connected to the first conductive portion at the secondposition and carrying a second signal of a second frequency band; afirst variable element (e.g. first variable element T1 in FIG. 10 )included in the middle of the first electrical path; a second variableelement (e.g. second variable element T2 in FIG. 10 ) included in themiddle of the second electrical path; and at least one processor (e.g.,processor 980 in FIG. 10 ) configured to generate a control signalcorresponding to the current mode of the electronic device and apply thecontrol signal to the first variable element and/or the second variableelement.

In various embodiments, the first frequency band may include frequenciesin the range of about 900 MHz to about 1200 MHz, and the secondfrequency band may include frequencies in the range of about 750 MHz toabout 850 MHz.

In various embodiments, the first variable element and/or the secondvariable element may include a tunable IC or a switch electricallyconnected to at least one of plural active elements and/or passiveelements.

In various embodiments, the electronic device may further include athird electrical path (e.g., third electrical path 4703 in FIG. 7A)coupled with the second position through a dielectric.

In various embodiments, a third position (e.g., third position L3 inFIG. 10 ) of the first conductive portion farther than the firstposition from the non-conductive portion may be electrically connectedto the ground layer of the printed circuit board through a fourthelectrical path (e.g., fourth electrical path 9703 in FIG. 10 ).

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedin the appended claims and their equivalents.

What is claimed is:
 1. A portable communication device comprising: ahousing including a side member forming a side surface of the portablecommunication device, the side member including a first conductiveportion; a printed circuit board (PCB) accommodated in the housing, thePCB including a first electrical path and a second electrical path, thefirst electrical path configured to carry a first signal of a firstfrequency band and electrically connected to a first position of thefirst conductive portion, and the second electrical path configured tocarry a second signal of a second frequency band different from thefirst frequency band and electrically connected to a second position ofthe first conductive portion; a first switching circuit electricallyconnected to the first position of the first conductive portion and thefirst electrical path such that the first position is connected to aground layer of the PCB via the first switching circuit; and a secondswitching circuit electrically connected to the second position of thefirst conductive portion and the second electrical path such that thesecond position is connected to the ground layer via the secondswitching circuit.
 2. The portable communication device of claim 1,wherein the first switching circuit is serially connected with respectto the first position and the first electrical path.
 3. The portablecommunication device of claim 1, wherein the second switching circuit isserially connected with respect to the second position and the secondelectrical path.
 4. The portable communication device of claim 1,wherein the PCB includes a third electrical path electrically connectedto a third position of the first conductive portion and the ground layerof the printed circuit board.
 5. The portable communication device ofclaim 1, wherein the first electrical path is electrically connected tothe first position via the first switching circuit and a firstconnection portion of the PCB.
 6. The portable communication device ofclaim 5, wherein the first connection portion of the PCB is disposed asat least partially overlapped with the first position.
 7. The portablecommunication device of claim 1, wherein the second electrical path iselectrically connected to the second position via the second switchingcircuit and a second connection portion of the PCB.
 8. The portablecommunication device of claim 7, wherein the second connection portionof the PCB is disposed as at least partially overlapped with the secondposition.
 9. The portable communication device of claim 1, wherein thefirst position is selectively connected to the ground layer of the PCBvia the first switching circuit, and wherein the second position isselectively connected to the ground layer via the second switchingcircuit.
 10. The portable communication device of claim 1, furthercomprising: a communication circuit configured to: apply a controlsignal to at least one of the first switching circuit and the secondswitching circuit such that the first conductive portion is toselectively operate, as at least part of an antenna radiator, at thefirst frequency band or the second frequency band.
 11. The portablecommunication device of claim 1, wherein the first position ispositioned within the first electrical path.
 12. The portablecommunication device of claim 1, wherein the second position ispositioned within the second electrical path.
 13. The portablecommunication device of claim 1, further comprising: a second conductiveportion, and a non-conductive portion formed between the firstconductive portion and the second conductive portion wherein the firstposition is positioned farther than the second position with respect tothe non-conductive portion.
 14. The portable communication device ofclaim 1, wherein the first electrical path connects the first conductiveportion to a wireless communication circuit at the first position. 15.The portable communication device of claim 1, wherein the secondelectrical path connects the first conductive portion to a wirelesscommunication circuit at the second position.
 16. The portablecommunication device of claim 1, at least one of the first switchingcircuit and the second switching circuit includes a plurality of passiveelements for selective switching.